In electronic devices such as new energy vehicle battery packs, 5G base station power supplies, and LED drivers, thermally conductive potting compounds serve multiple functions, including heat dissipation, insulation, moisture protection, and shock resistance. Anhui Aiyota's epoxy-based silane, amino-based silane, and vinyl-based silane coupling agents provide key material support for improving the overall performance of potting compounds.

Thermally conductive potting compounds require a large amount of thermally conductive fillers such as alumina, boron nitride, and zinc oxide (60-90% filler content). Silane coupling agents can form a chemically bonded layer on the filler surface, improving filler dispersibility, reducing system viscosity, and enhancing the interfacial bonding between the filler and the matrix. Experiments show that adding 1-2% silane coupling agent increases the thermal conductivity of the potting compound by 20-30%, improves shear strength by 50%, and increases the performance retention rate after damp heat aging from 60% to 85%.

Aiyota provides a series of silanes for electronic potting, including γ-glycidoxypropyltrimethoxysilane (KH-560), γ-aminopropyltriethoxysilane (KH-550), and vinyltrimethoxysilane (KH-171), with a purity of ≥97% and excellent hydrolytic stability. These products have been applied in silicone potting compounds, epoxy potting compounds, and polyurethane potting compounds, and have passed UL94 V-0 flame retardant certification and ISO10993 biocompatibility testing. Our technical team can provide filler surface treatment, formulation optimization, and reliability verification services.