As chip manufacturing technology advances toward the nanometer scale, the requirements for material purity and process stability have become increasingly stringent. Hexamethyldisilazane (HMDS) plays a vital role in the semiconductor manufacturing process.

In photolithography, HMDS is commonly used as an adhesion promoter for photoresist. After the silicon wafer surface is cleaned, residual hydroxyl groups remain; these groups readily adsorb moisture, which can compromise the bonding between the photoresist and the wafer surface.

HMDS reacts with these surface hydroxyl groups to form a hydrophobic organosilicon film on the wafer. This film effectively enhances photoresist adhesion, reduces pattern defects, and improves the precision of circuit pattern transfer.

Thanks to its high purity and excellent volatility, HMDS is widely used in the fields of integrated circuits, MEMS devices, and advanced packaging technologies. It is fair to say that HMDS has become an indispensable auxiliary material in the modern microelectronics supply chain.