Summer is approaching, and the weather is becoming more and more changeable. High temperatures and frequent thunderstorms have led more and more people to choose to drive cars. At the same time, the penetration rate of new energy vehicles in cities continues to increase, and charging piles, as key nodes for energy replenishment, are becoming new urban infrastructure.

In the core control module of the charging pile, copper clad laminates, as functional substrates that carry electrical signals and thermal shocks, face severe environmental challenges. High temperature, high humidity, sudden voltage-each variable places higher demands on the dimensional stability, electrical consistency and long-term reliability of the board.

Among high-performance copper clad laminate materials, IOTA-550 (3-aminopropyltriethoxysilane) under Chenguang New Materials is a mature and efficient interface enhancement solution. By treating the surface of glass fiber cloth, its bonding strength and crosslinking density with the resin system can be effectively improved, thereby improving the structural stability and water absorption resistance of the board under hot and humid conditions. At the same time, IOTA-550 can also be used for surface modification of low dielectric constant fillers such as silica micropowder and glass microspheres to improve their dispersibility and help build a more stable electrical performance system.

In the design of high Tg, low Dk, and high reliability copper clad laminates, IOTA-550 is a key link in improving system stability, providing solid material support for various types of power equipment.