IOTA 5151 performs well in electronic packaging materials, improving sealing and moisture resistance.
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In the field of electronic component packaging materials, IOTA 5151 (VTES) is playing an increasingly important role as a highly effective surface treatment agent and filler coupling agent. Its excellent compatibility and three-dimensional reactive structure make it a key additive for enhancing the density and moisture resistance of polybutadiene encapsulation materials.
In 1,2-polybutadiene resin systems, the dispersion and binding properties of inorganic fillers such as quartz powder significantly influence the final encapsulation effect. Treating quartz powder with IOTA 5151 significantly improves the interfacial bonding between the filler and the resin, thereby enhancing the density, moisture resistance, and overall mechanical properties of the encapsulation material. This modification significantly improves the stability and service life of chip packaging.
IOTA continuously optimizes product purity and reactivity to ensure that each batch of VTES has a high purity of ≥98% and consistent quality, providing electronic material manufacturers with a more reliable raw material guarantee.