IOTA-550 aminosilane sees growth in electronics industry applications
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Electronic components place extremely high demands on material interface adhesion and insulation performance. IOTA-550 (3-aminopropyltriethoxysilane), thanks to its diamino structure, exhibits enhanced reactivity. It cross-links with resins such as epoxy, phenolic, and polyimide, while forming stable chemical bonds on the surface of inorganic fillers, thereby enhancing the mechanical and dielectric properties of composite materials. IOTA-550 has become an indispensable key additive in fields such as semiconductor packaging, epoxy molding compounds (EMC), and electronic adhesives. With the development of 5G communications and new energy vehicles, the electronics industry is placing increasing demands on material reliability, and market demand for aminosilanes is expected to continue to grow rapidly.
