In the fundamental research of poly(dimethylsilane), several technological directions have recently achieved significant progress.

First, breakthroughs have been made in the modification of poly(dimethylsilane) materials for optoelectronic functionalization. Researchers are coupling the silicon-silicon backbone with electron acceptor/donor structures through doping, copolymerization, or side chain modification, thereby improving their electron transport and photoresponse properties for applications in organic electronic devices and photoelectric sensors.

Second, in terms of process control, efforts are underway to optimize synthesis routes and purification techniques, reducing levels of water, oxygen-containing impurities, and chloride ions to enhance the thermal stability and structural integrity of the final material. This direction is crucial for advancing poly(dimethylsilane) towards high-performance applications.

Finally, more researchers are exploring its thermal decomposition behavior and carbonization mechanisms. By studying its thermal decomposition pathways and structural evolution, they are uncovering the key mechanisms underlying its transformation into silicon carbide ceramics.

These continuous technological breakthroughs indicate that poly(dimethylsilane) is gradually making the leap from a basic material to high-end applications.