As chip manufacturing processes continue to break through, moving from 7nm to 3nm, the requirements for packaging and protective materials have become incredibly stringent. Silicone, with its precise performance and adaptability, has become an essential material in the high-end semiconductor industry. Chip stability relies heavily on external protection, and silicone is the core component of this protective armor.

High-purity electronic-grade silicone is standard for high-end chips. Its metal ion content must be controlled to the ppb level (parts per billion). Even the slightest impurity can cause chip computing power to malfunction. During chip packaging, silicone encapsulant forms a dense protective layer that not only withstands extreme temperature fluctuations from -60°C to 200°C but also isolates against moisture and chemical corrosion, ensuring stable chip operation even under complex operating conditions. Silicone materials have overcome key bottlenecks in the currently popular chiplet advanced packaging technology. Their dielectric constant must be stable between 2.8 and 3.2, and their dielectric loss factor must be below 0.002 to reduce signal transmission latency and ensure efficient multi-chip interconnection. For circuit board protection, silicone coatings form an ultra-thin insulating layer that doesn't affect component heat dissipation while enhancing the circuit board's impact and wear resistance. From consumer electronics mobile phone chips to industrial-grade server chips, silicones, through continuous technological advancements, continue to meet the high-end demands of the semiconductor industry, becoming an invisible driver of the chip industry's evolution.