3-(2,3-Epoxypropyloxy)propyltrimethoxysilane, as an epoxy-containing silane coupling agent, is gradually becoming an indispensable key auxiliary agent in the composite materials industry. In the field of epoxy resins, especially in electronic sealants and printed circuit board packaging materials, this product greatly improves the bonding strength between resins and inorganic fillers or matrix materials with its excellent coupling performance.

In practical applications, this silane can react with the main chain or terminal groups in epoxy resins, and its trimethoxy group can form stable chemical bonds with glass, metal, and mineral surfaces after hydrolysis. This dual reaction mechanism ensures that the product has significant advantages in improving mechanical strength and electrical performance stability.

Especially in the field of printed circuit board manufacturing, it can be used as an electronic-grade primer to improve interface performance, electrical insulation and thermal stability. Today, more and more electronic component manufacturers are using it as a standard raw material to lead the transformation of industry standards.