3-Glycidyl etheroxypropylmethyldiethoxysilane (chemical formula C11H24O4Si, CAS number 2897-60-1) is an important organosilicon compound, also known as (3-glycidyl etheroxypropyl)methyldiethoxysilane. Structurally, it ingeniously combines epoxy groups and hydrolyzable ethoxysilane groups, a unique molecular design that endows it with the special ability to connect organic and inorganic materials.

This compound is liquid at room temperature, with a boiling point of 122-126°C (5 mmHg), a refractive index of 1.431, a flash point of 110°C, and a density of 0.978. In its molecular structure, the epoxy groups endow it with the ability to react with various organic resins, while the silane moiety can form strong chemical bonds with the surface of inorganic materials. It is this dual nature that makes it an indispensable "molecular bridge" in materials science, playing a crucial role in composite materials, coatings, and adhesives.